Home > PCBA Manufacturers >

OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba

Product Categories

PCB Assembly [150]
Turnkey PCB Assembly [73]
PCBA Board [50]
PCBA Manufacturers [59]
PCBA Electronics [51]
PCBA Prototype [55]
Printed Circuit Board Assembly [39]
Electronic Board Assembly [27]
PCB Manufacturing [24]
FR4 PCB [29]
Multilayer PCBs [26]
Rigid Flexible PCB [28]
Flexible PCBs [19]
High Frequency PCBs [21]
HDI PCB [12]

FASTPCBA Co., Ltd.

Contact Now

OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba

Name: OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba
Brand: FASTPCBA
Price: 1 USD

China OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba wholesale

Brand Name : FASTPCBA

Model Number : One-Stop PCBA Manufacturers

Certification : IATF16949, ISO13485, ISO9001

Place of Origin : China

MOQ : 1pcs

Price : 1

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 150000 Pieces per Month

Delivery Time : 5

Packaging Details : PCB: Vacuum Packing/ PCBA: ESD Packing

Name : OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba

Keyword : PCB Assembly And Soldering

Number of layers : 1-48

Material : FR4, High TG FR4, High Frequency, Alum, FPC

Min space : 0.075mm

Sub-assembly : Plastic,metal,screen

Max size of finish board : 700*460mm

Package : QFN,BGA,SSOP,PLCC,LGA

Surface Treatment : HASL, HASL Lead Free, Immersion Gold, Immersion Tin, Immersion Silver, Hard Gold, Flash Gold, OPS…

ROHS : CANEC1308721101

Process Characteristics : HDI Blind Buried Hole Process, High BGA Density, Small Hole-To-Line Spacing

Solder mask : Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue

Contact Now

Fr4 Double Side Prototype Pcb Diy Universal Pcb Printed Circuit Boards With China Pcb Manufacturer Assembly

ADVANCED INSPECTION MACHINE:

FASTPCBA Co., LIMITED advanced PCB production and testing equipment purchased from the United States, Japan, Germany, Israel and other places to improve production testing and technical capabilities. Adopting international advanced process technology and advanced management methods, the technological level is constantly improved from their high standards and strict requirements.

PCB Capability

Article	Description	Capability
Material	Laminate materials	FR4, High TG FR4, High Frequency, Alum, FPC...
Board Cutting	Number of layers	1-48
Board Cutting	Min.thickness for inner layers (Cu thickness are excluded)	0.003”(0.07mm)
Board Thickness	Standard	(0.1-4mm±10%)
	Min.	Single/Double:0.008±0.004”
		4layer:0.01±0.008”
		8layer:0.01±0.008”
	Bow and twist	no more than 7/1000
Copper Weight	Outer Cu weight	0.5-4 0z
Copper Weight	Inner Cu weight	0.5-3 0z
Drilling	Min size	0.0078”(0.2mm)
	Drill deviation	±0.002″(0.05mm)
	PTH hole tolerance	±0.002″(0.005mm)
	NPTH hole tolerance	±0.002″(0.005mm)
Solder Mask	Color	Green,white,black,red,blue…
	Min solder mask clearanace	0.003″(0.07mm)
	Thickness	(0.012*0.017mm)
Silkscreen	Color	white,black,yellow,blue…
Silkscreen	Min size	0.006″(0.15mm)
Max Size of Finish Board	700*460mm
Surface Finish	HASL,ENIG,immersion silver,immersion tin,OSP…
PCB Outline	Square,circle,irregular(with jigs)
Package	QFN,BGA,SSOP,PLCC,LGA

PRODUCT CONFIGURATION:

4/2 (optional 6-inch) image intensifier and megapixel digital camera;
90KV / 100KV-5 micron X-ray source
Simple mouse click operation to write detection program;
High detection repeat accuracy;
Rotational tilt of plus or minus 60 degrees allows unique perspectives to detect samples;
High-performance stage control;
Large navigation window-easy to locate and identify defective products;
Automatic BGA detection program accurately detects every BGA bubble
Make judgments according to customer needs and output Excel reports.

OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba

PRODUCT APPLICATION:

PCBA solder joint inspection (BGA, CSP, POP and other components inspection)
Battery (Pole piece solder joint defect detection, cell winding condition detection)
Electronic connectors (harnesses, cables, plugs, etc.)
Automotive electronics (testing of patch cords, dashboards, etc.)
Solar, photovoltaic (wafer solder joint inspection)
Testing for special industries such as aviation components
Semiconductor (package component inspection)
LED detection
Electronic module detection
Ceramic products testing

OEM Multilayer Rapid Prototyping Pcb Assembly Service Rapid Pcba

Product Tags: